Application Notes

Optimization of Injection Molding Processes Using Design of Experiments

Application Notes

Application Note for MKS Instruments SenseLink™ QM for Optimization of Injection Molding Processes Using Design of Experiments

Silicon Wafer Production

Application Notes

The silicon wafers so familiar to those of us in the semiconductor industry are actually thin slices of a large single crystal of silicon that was grown from melted electronic grade polycrystalline silicon.

Thin Film Deposition

Application Notes

The thin films that are used to fabricate microelectronic devices are all formed using some kind of deposition technology where the term refers to the formation of a deposit on a substrate.

Low Pressure Chemical Vapor Deposition

Application Notes

Reactor configurations that have been used for LPCVD thin film processes include resistance heated tubular hot-wall reactors, vertical flow batch reactors and single-wafer reactors.

Plasma Enhanced Chemical Vapor Deposition

Application Notes

The key advantages sought in the use of PECVD vs. LPCVD were the ability to reduce process temperatures while maintaining or increasing deposition rates.

Atomic Layer Deposition

Application Notes

Atomic layer deposition is similar to LPCVD except that the chemical process is broken down into steps that isolate different adsorption and reaction steps to have self-limiting reactions.

Semiconductor Etching

Application Notes

Etching refers to any technology that will selectively remove material from a thin film on a substrate and by this removal create a pattern of that material on the substrate.

Isotropic Radical Etching

Application Notes

High pressure plasma etching processes typically operate around 0.2 - 2 Torr. These are glow discharge methods that etch material via a chemical rather than a physical mechanism.

Reactive Ion Etching

Application Notes

Reactive Ion Etching (RIE) uses a combination of chemical and physical reactions to remove material from a substrate; it is the simplest process that is capable of directional etching.

Physical Sputtering and Ion Milling

Application Notes

Sputtering and ion milling are purely physical processes in which heavy atomic positive ions, created in a plasma, are accelerated to impact a substrate surface to remove material.
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