Polysilicon thin films are produced using a process known as chemical vapor deposition or CVD. Heavily doped polysilicon and poly-silicide films have been used as gate electrodes and …
Epitaxy is defined as the "regularly oriented growth of one crystalline substance on another". Both homoepitaxy and heteroepitaxy processes are used in semiconductor device fabrica …
Compound semiconductors are materials such as GaAs, AlGaAs, GaN, CdSe, InP, InSb, etc. These materials combine the elements from equidistant columns on either side of Column IVA of …
Thermal SiO2 films for device components can be formed in a variety of ways; the selection of method is dependent on such factors as substrate composition/topography and the thermal …
In semiconductor device fabrication, contacts are the metal components in direct contact with silicon in transistors and other devices, while interconnects are the current-carrying …
Chemical vapor deposition processes can be defined as: any process in which a thin solid film is formed on a substrate by the surface-mediated reaction of adsorbed precursors from the …
Semiconductor fabrication utilities include ultrapure water, bulk high purity gases such as nitrogen and argon, exhaust gas handling and disposal, and cleanroom air systems.
This technical note provides a basic familiarity with the design elements and functionalities for UPW systems. We will discuss the main UPW parameters, the treatment sequence for UPW …
A variety of gases are employed for different purposes within a semiconductor device fabrication plant. These gases range from the pyrophoric and/or toxic specialty gases required for …
The process exhaust downstream from the cleaning, deposition and metal etch processes often experiences problems due to fouling often caused by the condensation and build-up of process …
Semiconductor fab environments require ultra-clean conditions to ensure low numbers of product defects due to particulate contamination. A critical aspect in creating an ultra-clean …
Modern 12-inch fabs have fully automated wafer processing, metrology, inspection, material handling, and device packaging with little or no human intervention between the introduction …
When it comes to electrical characteristics, solid matter falls into one of three categories: it is either a conductor, an insulator, or a semiconductor, depending on whether or how …
The electrical property that makes semiconducting materials so valuable in electronics applications arises from the fact that their electrical conductivity can be continuously vari …
When p-type semiconductor and n-type semiconductor materials are placed in physical contact, the area around the contact (known as the junction) behaves differently than either of the …
The characteristic response of a solid state diode to an external electrical potential or to an energy source such as light forms the basis for devices such as bipolar junction transistors, …
BJT operation involves both electrons and holes. It can be configured as either a PNP transistor or an NPN transistor which can be constructed as either a three-layer sandwich or as …
MOSFETs are planar surface devices that are the most commonly used variant of Field Effect Transistors (FETs);including Junction Gate Field Effect Transistors (JFETs) and Insulated …
It can be seen that all of the familiar components of a MOS device are present in the FinFET (drain, source, gate, gate dielectric) and that the device more effectively separates the …
Flash transistors are used in memory devices. Their design is similar to that of MOSFETs with the main design difference being that they employ two gates rather than one.