MULTI-GAS, MULTI-RANGEMASS FLOW CONTROL
MKS introduces two new flow control solutions - the P-Series
and G-Series multi-gas, multi-range Mass Flow Controller families.
These high performance MFCs feature full digital control
architecture for fast response to setpoint over operable device
range - the perfect solution for virtually any application.
ADVANCED, HIGH PEFORMANCEPRESSURE MEASUREMENT
Providing best-in-class capacitance manometer technology, MKS
introduces the a-Baratron® capacitance manometer - developed
specifically for use in vacuum and pressure measurement
applications where high accuracy and excellent repeatability are
crucial to process success.
FTIR-BASED CONTINUOUSEMISSIONS MONITORING
Presenting the MGS300 System - a fully integrated and certified
continuous emissions monitoring system based on high resolution
FTIR technology. The MGS300 provides real-time analysis for a
broad range of gas components over the most challenging of
ALL-IN-ONE TEMPERATURECONTROL SOLUTION
For the latest in semiconductor, solar and MOCVD applications,
MKS offers the MultiTherm 1000 Temperature Controller featuring
16 precision sensor input channels and 16 PWM output channels.
Built-in PID makes this unit ideal for dynamic control applications
where extreme temperature stability is required.
REMOTE PLASMA SOURCE FORNEW PROCESS APPLICATIONS
The new ASTRON® Paragon Reactive Gas Generator is the latest platform
in the industry leading family of ASTRON remote plasma sources.
Building on the production proven attributes of existing ASTRON
reactive gas generators, Paragon is designed with improvements
to enable the next generation of process development.
MKS Completes Acquisition of Granville-Phillips®, a leading global provider of vacuum measurement and control instruments
MKS Instruments reports 2014 second quarter financial results
The new a-Baratron® Heated Absolute Capacitance Manometer -
All-digital architecture and improved thermal management provide better long-term stability, improved accuracy, and increased reliability for difficult etch and deposition processes.