Process Sense™ NDIR Analyzer for Chamber Clean Endpoint Detection

The Process Sense™ endpoint sensor is a small, low cost partial-pressure analyzer specifically designed to determine the completion of plasma chamber cleaning for both semiconductor and flat panel deposition chambers. Process Sense™ is based on infrared absorption, the only technique applicable to all (in-situ and remote) plasma cleaning processes.

Features & Benefits:

• Fast response enables real-time chamber clean endpoint detection - lower Cost of Ownership,
• Reduces chamber erosion from over cleaning - extending the life of the chamber,
• Optimizing chamber clean time increases tool availability,
• Reduced over-clean lowers particulate generation for improved yield,
• Permanent calibration unaffected by process conditions,
• Complete upgrade kits available for AMAT CVD tools.

Applications:

• Chamber Clean Endpoint for Applied Materials CVD Tools,
• Silicon Oxides (USG, FSG, PSG, BSG, BPSG),
• Silicon Nitrides,
• Polysilicon,
• Silane or TEOS processes.