Process Sense
Non-dispersive Infrared Chamber Clean Endpoint

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Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). The Process Sense gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.

Features & Benefits:

  • Reduced chamber clean times
  • Reduced chamber clean cost
  • Minimum particle events
  • Reduced NF3 usage
  • Reduced power consumption
  • Increased wafer throughput of CVD tool
  • Accurate determination of chamber clean endpoint
  • Low-cost filter-based analyzer

Applications:

  • Chamber clean endpoint for SiF4
  • Sensitivity to SiF4 down to 1ppm
  • Simple analog output for reported concentration signal
  • Silicon Oxides (USG, FSG, PSG, BSG, BPSG)
  • Silicon Nitrides
  • Polysilicon
  • Silane or TEOS processes

Configurations:

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Need help?

Contact an Application Specialist by sending an email to MKS Instruments or call 978-645-5500.