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liquozon vario3 ozonated water delivery system with recirculation
Ozonated Water Delivery System, 3-90 ppm, 2-140 lpm, Optional Recirculation

Specifications

  • Type
    Ozone Water Delivery System
  • Ozone Concentration
    3-90 ppm
  • Flow Rate
    2-140 lpm
  • Feed Gas
    O2
  • Dopant Gas
    CO2
  • Wetted Surfaces
    Liquid: PFA, PTFE, quartz glass
    Gas: 316L stainless steel, PFA, PTFE
  • Control Interfaces
    Binary in/out, RS232/RS485, analog 4 - 20 mA in/out, USB
  • Dimensions
    1810 x 800 x 610 mm (71.2 x 31.5 x 24.1 inches)Approximate (height x width x depth), Overall height including exhaust duct and adjustable feet: Approx. 2000 mm (79 inches)
  • Weight
    315-400 kg, depending on configuration
  • Compliance
    CE, SEMI F47, SEMI S2

Features

Leading Technology

  • MKS proprietary contacting system allows >80% ozone mass transfer
  • <5% concentration accuracy at constant flow rates typical
  • Green idle modes reduce excess water usage

Process

  • Wide operation window with tight process control
  • Analog and digital bidirectional communication with remote control
  • High purity ozone environment

Reliability & Maintenance

  • High unit to unit reliability and repeatability
  • Market proven components with long life-spans
  • Easy installation and operation

Semiconductor Applications:

The LIQUOZON VariO3 platform hosts a number of models inside the same cabinet, covering a wide range of performance. The low concentration VariO3 delivers up to 90 ppm DI-O3 at rates of 2 liters/min and up to 15 ppm DI-O3 and flow rates of up to 60 liters/min (Figure 1).

The standard version (Figure 2) delivers a maximum of 31 ppm DI-O3 at 60 liters/min while having a boosted mid-range performance. Both are ideally suited for single wafer cleans, oxide growth, and post CMP cleans as well as immersion applications.

VariO3 Characteristic performance chart of a low concentration delivery system
Figure 1 – Characteristic performance chart of a low concentration delivery system
VariO3 Characteristic performance chart of a standard concentration and flow rate
Figure 2 - Characteristic performance chart of a standard concentration and flow rate

Specified achievable dissolved ozone concentration in UPW for a system pressure of 2.5 barg, a cooling water temperature and UPW temperature of 20°C.

Water consumption is a serious concern for semiconductor fabs. Depending on the process step, ultra-pure water may be required to constantly stream resulting in significant waste of water. The LIQUOZON Ozonated Water Delivery System is equipped with multiple modes to improve water usage efficiency by lowering initial water consumption and reclaiming used process water. The LIQUOZON VariO3 supports Idle Modes 15, 155, and 159 as shown below.

VariO3  Idle, Recirculation, and Reclaim run modes for the LIQUOZON® VariO3 Recirculation System
Idle, Recirculation, and Reclaim run modes for the LIQUOZON® VariO3 Recirculation System

Thin Film Applications:

The LIQUOZON® VariO3 for Electronic Thin Film (also known as Flat Panel Display) system is designed for use with wet benches having cleaning applications requiring up to 140 L/min DI-O3 flow and ozone concentrations of 25 - 90 ppm (Figure 1). The LIQUOZON® VariO3 system uses closed-loop controls to maintain stable DI-O3 concentrations, even with varying DI-O3 demands. The built-in optional pump makes it ideally suited for fabs with low pressure UPW supply.

VariO3 Characteristic performance chart of a standard concentration and flow rate
Specified achievable dissolved ozone concentration in UPW for a system pressure of 2.5 barg, a cooling water temperature and UPW temperature of 20°C. At higher UPW temperatures, lower system pressure or higher cooling water temperature, the maximum performance will decrease.

Facilities Requirements

O2: ≥ Grade 4 (purity ≥ 99.99%)

  • Inlet Pressure: 4.5-7.6 barg (65-110 psig), at least higher 3 bar than system pressure
  • Flow Rate: ≤ 15 slm, typical 9 slm, according to SEMI E12 (0°C/1.01325 bar)

Dopant Gas CO2: ≥ Grade 4.5 (purity ≥ 99.995%)

  • Inlet Pressure: 5.0-7.6 barg (73-110 psig)
  • Flow Rate: Typical 0.15-0.5 slm, depending on the configuration

Ultra-Pure Water (UPW)

  • Half Life Time of O3 in UPW: >12 min @ 20°C, (which is standard in semiconductor fabs)
  • UPW IN Pressure (full flow): 1-5 barg (14.5-73 psig) maximum, 0.8 bar higher than system pressure
  • Temperature: 15-25°C (59-77°F), rated 20°C (68°F)

Cooling Water

  • Quality: Demineralized, filtration ≤ 20 µm
  • Temperature: 17-23°C (63-73°F), rated 20°C (68°F)
  • Pressure: Maximum 5.0 barg (73 psig) differential pressure ≥ 3 bar
  • Flow Rate: 3.0- >10.0 L/min (0.8- >2.6 gpm), depending on the configuration

Power: 3/PE~, 200-208 V ±10%, 50/60 Hz, 850-8000 W

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