CVD or Etch Process Monitor, High Sensitivity, 1-300 amu, Multi-pressure

Technical Specs

  • Mass Range
    1 - 300 amu
  • Detector
    Dual (Faraday and secondary electron multiplier)
  • Maximum Analyzer Operating Pressure
    1e-3 Torr at the ion source inlet (standard), higher pressure optional
  • Minimum Detectable Concentration
    <15 ppb specified with Argon or Nitrogen
  • Mass Stability
    Better than ±0.1 amu over 8 hours
  • Resolution
    Better than 10% valley for peaks of equal height across mass range
  • Bake Out Temperature
    180°C with Bakeout Jacket
  • Ion Source
    High conductance closed ion source
  • Filaments
    Twin Tungsten filaments
  • Mass Filter
    Double filter (1 in. "RF only" pre-filter with 4 in. main filter)
  • Weight
    33 lbs. (15 kg) to bolt on Process System
  • Power Requirements
    88 - 264 VAC, 47/63 Hz, 600 W
  • Operating Temperature
    90°C (controlled to ±1°C)
  • Maximum Operating Conditions
    Electronics: 10 - 40°C, 80% RH (non condensing)
  • LED Status Indication
    Interlock status, filament emission, SEM, power and communications
  • I/O Capability
    4 analog inputs and 2 outputs (plus 1 dedicated gauge input). Optional support for a large number of both analog and digital inputs and outputs, including relay control
  • Other Facilities
    Leak check headset socket, external filament trip socket, instrument reset
  • Software
    Process Eye Professional fully network compatible control platform generating under 32 bit or 64 bit Microsoft Windows XP, Vista, Server 2008 or Windows 7
  • Communication
    Ethernet CAT-5e
  • PC Requirements
    Intel Pentium IV or AMD Athlon XP 1.2 GHz, 1GB RAM, 120 GB hard drive, dependent upon total number of sensors on the computer and the operating system in use. Multi-sensor installation may require higher specifications.
  • Simultaneous Multi-Sensor
    Process Eye Professional client/server configuration offers flexible multi-sensor operation.
  • Shipping Weight
    44 lbs (20 kg) may vary depending upon backing pump and instrument rack requirements
  • Compliance
    Compliant to RoHS Directive 2002/95/EC (control unit)
  • Base Pressure Range
    Ion source at maximum pressure at 1, 10 or 100 mTorr
  • Process Pressure Range
    Ion source at maximum pressure at 10, 100, 500, 1.5, 5, 10, 40, 100 or 700 Torr (*Optional gas acceleration for ranges <10 Torr available. For other inlet and process pressure ranges, please consult the factory).
  • Mounting Flange
    DN35CF (70 mm/2.75 in. OD) Conflat. Custom adapters can be provided.
  • Vacuum Hardware
    60 l/s turbomolecular pump with high conductance analyzer housing, inlet system, UniBloc™ inlet, automated vacuum control (RVC) completely interlocked and integrated
  • Backing Vacuum System
    Standard: Connected to the tool foreline pump via Surge Protect assembly with a KF16 fitting, Optional: Independent chemically resistant, dry diaphragm pump with KF16 fitting for connecting the exhaust to a suitable scrubber system
  • Mobile RGA Platform
    Optional RGA trolley to improve versatility (footprint 18 x 24 in., 455 x 604 mm)
  • Pneumatics
    60-80 psig CDA
  • Type
    Residual Gas Analyzer
  • Analyzer Housing Base Pressure
    Better than 5e-9 Torr after bakeout
  • Electronics Weight on Flange
    1.7 kg
  • Mechanical Support
    Optional stands and brackets are available
  • RGA to Vacuum System Cable Length
    33 ft. (10 m) standard RGA and 10 ft. (3 m) with mobile RGA platform. Other lengths available dependent upon process system and customer requirements
  • Measurement Technique
    Mass Spectrometry

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