Compare Model Drawings, CAD & Specs Availability Price
vision 2000-c and e xd high sensitivity multi-pressure, cvd/ald rga
CVD or Etch Process Monitor, High Sensitivity, 1-300 amu, Multi-pressure
vision 2000-c and e xd high sensitivity multi-pressure, cvd/ald rga
CVD or Etch Process Monitor, High Sensitivity, 1-200 amu, Multi-pressure

Specifications

  • Mass Range
    1-300 amu
  • Detector
    Dual (Faraday and secondary electron multiplier)
  • Maximum Analyzer Operating Pressure
    1e-3 Torr at the ion source inlet (standard), higher pressure optional
  • Minimum Detectable Partial Pressure
    <2e-11 Torr (for total pressures <1e-4 Torr on baseline inlet)
  • Minimum Detectable Concentration
    <15ppb specified with Argon or Nitrogen
  • Mass Stability
    Better than ±0.1 amu over 8 hours
  • Resolution
    Better than 10% valley between peaks of equal height throughout the mass range
  • Bakeout Temperature and Bakeout Jacket
    Included for 180°C bakeout
  • Ion Source
    High conductance closed ion source
  • Filaments
    Independently replaceable twin Tungsten filaments
  • Mass Filter
    Double filter (1-inch "RF only" pre-filter with 4-inch main filter)
  • Weight
    Control Module: 1.7 kg
  • Power Requirements
    88-264 VAC, 47/63 Hz, 600 Watts
  • Operating Temperature
    Electronics: 10-40°C
  • Maximum Operating Conditions
    80% RH (non condensing)
  • LED Status Indication
    Interlock status, filament emission, SEM, power and communications
  • I/O Capability
    4 analog inputs and 2 outputs (plus 1 dedicated gauge input). Optional support for a large number of both analog and digital inputs and outputs, including relay control
  • Other Facilities
    Leak check headset socket, external filament trip socket, instrument reset
  • Software
    Process Eye® Professional fully network compatible control platform generating under 32bit or 64bit Microsoft® Windows® xP, Vista, Server 2008 or Windows 7* (*recommended)
  • Communication
    Ethernet CAT-5e
  • PC Requirements
    Intel® Pentium IV® or AMD Athlon xP 1.2GHz, 1GB RAM, 120 GB hard drive, dependent upon total number of sensors on the computer and the operating system in use. Multi-sensor installation may require higher specifications.
  • Simultaneous Multi-Sensor
    Process Eye Professional client/server configuration offers flexible multi-sensor operation.
  • Shipping Weight
    44 lbs (20 Kg)
  • Compliance
    Compliant to RoHS Directive 2002/95/EC (control unit)
  • Base Pressure Range
    Ion source at maximum pressure at 1 mTorr, 10 mTorr or 100 mTorr
  • Process Pressure Range
    Ion source at maximum pressure at 10 mTorr, 100 mTorr, 500 mTorr, 1.5 Torr, 5 Torr, 10 Torr, 40 Torr, 100 Torr or 700 Torr
  • Mounting Flange
    DN35CF (70mm/2.75 inches OD) Conflat® flange
  • Vacuum Hardware
    60 l/s turbomolecular pump with high conductance analyzer housing, inlet system, UniBloc™ inlet, automated vacuum control (RVC) completely interlocked and integrated
  • Backing Vacuum System
    Standard: Connected to the tool foreline pump via Surge Protect assembly with a KF16 fitting
    Optional: Independent chemically resistant, dry diaphragm pump with KF16 fitting for connecting the exhaust to a suitable scrubber system
  • Mobile RGA Platform
    Optional RGA trolley to improve versatility (footprint 18x24 inches, 455x604mm)
  • Pneumatics
    60-80 psig CDA
  • Mechanical Support
    Optional stands and brackets are available

Features

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