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delta ii 2-zone flow ratio controller with devicenet
DLT2A2
Flow Ratio Controller, 2 Channels, DeviceNet
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 DLT2A2 Flow Ratio Controller, 2 Channels, DeviceNet
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delta ii 2-zone flow ratio controller with ethercat
DLT2B
Flow Ratio Controller, 2 Channels, EtherCAT
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 DLT2B Flow Ratio Controller, 2 Channels, EtherCAT
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Specifications

  • Full Scale Flow Range
    500/500 sccm, 1000/1000 sccm, 2000/2000 sccm, or 10000/10000 sccm (N2 equivalent)
  • Maximum Operating Outlet Pressure
    200 torr
  • Maximum Allowable Outlet Pressure Differential
    50 torr (between Q1 and Q2)
  • Normal Operating Pressure Differential
    <150 torr (<450 torr for 10000/10000) (N2)
  • Proof Pressure
    1000 psig
  • Burst Pressure
    1500 psig
  • Input Flow Range
    5 to 100% of each channel Full Scale rating (N2 equivalent)
  • Ratio Control Range
    1:1 to 20:1 and 20:1 to 1:1
  • Ratio Accuracy
    2% of ratio set point
  • Typical Accuracy
    0.3% of ratio set point
  • Ratio Repeatability & Reproducibility
    0.02% of channel Full Scale
  • Zero Temperature Coefficient
    0.05% Full Scale/°C
  • Span Temperature Coefficient
    0.08% Reading/°C
  • Typical Settling Time
    <2 seconds
  • Warm-up Time
    30 minutes
  • Operating Temperature
    10 to 40°C
  • Storage Temperature
    -20 to 65°C
  • Storage Humidity
    0 to 95% relative humidity, non-condensing
  • Temperature Display
    0 to 100°C
  • Temperature Accuracy
    ±2°C
  • Temperature Resolution
    0.1°C
  • Fitting Type
    4 VCR male (non-rotatable)
  • Display
    4 digits for value, 4 characters for unit
  • External Leak Integrity
    <1x10-10 (scc/sec He)
  • Leak Integrity Through Closed Valve
    <2% of Channel FS at 400 torr differential
  • Wetted Materials
    316 stainless steel VAR, 316 stainless steel, Inconel®, KM-45, PTFE
  • Surface Finish
    5 microinch average Ra
  • Weight
    5 lbs. (2.3 kg)
  • Connector
    Digital I/O: 5-pin microconnector (DeviceNet), Analog: 9-pin D male, EtherCAT: 2 x RJ-45 (comm.) male, M8 male, 5 pin (power)
  • Power Requirements
    Digital I/O: 11-25 VDC, Analog: +15 to 24 VDC±5%
  • Power Consumption
    9 Watts
  • Set Point Command Signal
    Digital I/O: Digital, Analog: 0 to 5 VDC or 0 to 10 VDC
  • Communication
    Analog, DeviceNet, or EtherCAT

Features

Wide Dynamic Ratio Control Range

The DELTA II has a wider dynamic ratio control range and is more adaptive to different tool and process conditions. MKS has developed a unique patent pending ratio control algorithm enabling ratio and flow response times of less than two (2) seconds. This control algorithm also enables a twenty to one ratio control range, more than double its industry leading predecessor.

Tight Ratio Control While Changing Input Flow

The DELTA II maintains tight ratio control while the input flow is changed. Our unique patent pending ratio control algorithm enables ratio and flow response times of less than two seconds.

Embedded e-diagnostics

The DELTA II’s diagnostic feature allows the user to check the DELTA’s performance in-situ, lowering costs through reduced removal of “No Problem Found” devices. This feature is enabled through a web browser utility accessed through the device’s Ethernet port. This utility uses a standard web browser – no special software is required. For access, the IP address may be accessed through the devices bright LED display.

Flow Splitting Applications

Widely used in a variety of flow splitting applications such as etch, strip, and CVD, the DELTA II provides the user with the ability to distribute gas or gas mixtures to two different zones in a process chamber. Send the DELTA II a gas – or any mixture – and a ratio set point and the DELTA II will split the gas into two separate output channels automatically and precisely. 

Throughput and process control have always been critical to the semiconductor device manufacturer. With the advent of 300 mm wafers and dual process chambers, new methods of control gas flow distribution have become increasingly needed. 300 mm wafer processing often requires tunable control of gas distribution across the wafer to provide better process uniformity. Dual process chambers require proper gas distribution for chamber matching from single source gas panels.

Controller 9-pin Connector Pin-outs

 Pin  Description
 1  Valve Open/Close
 2  Ration Signal Output
 3  +15 VDC
 4  Power Common
 5  No Connection
 6  Ratio Set Point
 7  Signal Common
 8  Signal Common
 9  Remote Zero

Resources

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