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300mm photoresist detection monitor for high pressure degas
Photoresist Detection Monitor, 300 mm Resist-Torr®

Specifications

  • Mass Range
    1-200 amu
  • Detector
    Dual (Faraday and Secondary Electron Multiplier)
  • Minimum Detectable Concentration
    <100ppb for all common gases except <10ppm for H2
  • Mass Stability
    Better than ±0.1 amu over 8 hours at stable ambient temperature
  • Resolution
    Better than 10% valley between peaks of equal height throughout the mass range
  • Bakeout Temperature and Bakeout Jacket
    Included for 200°C bakeout
  • Ion Source
    High sensitivity, closed ion source
  • Filaments
    Replaceable twin Thoria filaments
  • Mass Filter
    Double filter (1 inch "RF only" pre-filter with 4 inch main filter)
  • Power Requirements
    88-264 VAC, 47/63 Hz, 600 Watts
  • Operating Temperature
    Electronics: 10-40°C
  • Maximum Operating Conditions
    80% RH (non condensing)
  • LED Status Indication
    Interlock status, filament emission, SEM, power and communications
  • I/O Capability
    4 analog inputs and 2 outputs (plus 1 dedicated gauge input). Optional support for a large number of both analog and digital inputs and outputs, including relay control
  • Other Facilities
    Leak check headset socket, external filament trip socket, instrument reset
  • Software
    Process Eye Professional fully network compatible control platform generating under 32bit or 64bit Microsoft® Windows® xP, Vista, Server 2008 or Windows 7 (recommended)
  • Communication
    Ethernet CAT-5e
  • PC Requirements
    Intel® Pentium IV® or AMD Athlon xP 1.2GHz, 1GB RAM, 120 GB hard drive, dependent upon total number of sensors on the computer and the operating system in use.
  • Simultaneous Multi-Sensor
    Process Eye Professional client/server configuration offers flexible multi-sensor operation
  • Shipping Weight
    85 pounds (38.5 Kg)
  • Mounting Flange
    2.75 inch Conflat® flange, SS capillary
  • Vacuum Hardware
    60 l/s turbomolecular pump with high conductance analyzer housing, fast response capillary inlet system, automated vacuum controller (RVC) completely interlocked and integrated
  • Pneumatics
    60-80 psig CDA
  • Foreline Pump
    Dry diaphragm standard
  • Analyzer Housing Base Pressure
    Better than 5x10-9 Torr after bakeout
  • Inlet
    Dual path with fast-response capillary for degas monitoring and high conductance for base vacuum. Includes heater jacket.
  • RGA to Vacuum System Cable Length
    33 feet (10 m)

Features

Detection of Photoresist Contamination

Installation Schematic

It is often difficult to know when a photoresist problem is affecting the productivity of a 300 mm PVD system. Even small amounts of residual resist, when introduced over a prolonged period, can reduce yields, cause particle contamination or slowly contaminate process chambers, thereby requiring premature kit changes. Major photoresist hits can be very costly, upwards of hundreds of thousands of dollars for lost wafers, especially if the tantalum/copper target becomes contaminated.

Resist can be inadvertently introduced to PVD systems in a number of ways. Rushing Hot Lots through opens the door to skipping steps like the resist strip or even the complete etch and strip cycle. This could result in contamination throughout the process tool if the wafer is not stopped at the degas chamber. Such process flow errors can impact PVD tool performance, immediately, from a single wafer. More common, however, is the incomplete removal of resist. This can happen due to a poorly controlled end point in the asher such as from firstwafer, cold-chamber effects, or from faults on integrated etch/strip tools.

Each of these mechanisms can leave resist contamination on wafers which eventually is seen as a loss of die or high particle densities in sputter etch process chambers. Resist contamination can be the cause of a series of factors, all of which work to reduce tool availability, increase COO, and decrease the overall yield of a process flow.

Calculation of the PR Index®

The 300mm Resist-Torr considers many different parameters of the degas step and combines that data to provide information in the form of a meaningful number, without the need for user-interpretation. This measurement, termed the PR Index®, is a normalized measure of wafer borne photoresist contamination that can be presented in various forms to compare data over time.

The 300mm Resist-Torr can interrupt the processing of any wafer automatically, without operator intervention, if a wafer enters the vacuum system with detrimental levels of residual photoresist, as determined by the PR Index.

PR Index trace for wafer sequence run at a foundry with interspersed normal and known PR contaminated wafers; red (alarm) and yellow (warning) lines show the default control limits PR Index trace for a series of test wafers run at a 300mm PVD tool OEM. The PR hit event was much longer than the preceding normal wafers because the tool was stopped on that wafer.

TOOLweb® RGA

Using TOOLweb RGA sensor integration option for process tools, the 300mm ResistTorr can be used as a degas chamber sensor in a completely automated process environment. TOOLweb RGA maintains a constant monitor of tool activities with all sensor data being framed by wafer logistics before alarm models are applied. Full alarm and data reporting to the FAB host and FDC are available so real time monitoring of chamber conditions and flagging of any process excursions from ideal conditions is possible.

TOOLweb® RGA Screen Home page for a tool with two 300mm ResistTorr degas modules.

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