Macro and Micro Processing

High Throughput, Low Cost-Per-Part Precision Laser Manufacturing

We offer solutions for laser Macro and Micro Processing of materials including cutting, drilling, marking, engraving, welding, annealing, scribing, heating, drying, coating, and laser lifting.

Laser Marking

For over 40 years lasers have been used in a variety of marking applications. Over the years, requirements in laser based marking applications such as smaller feature size, improved contrast, efficiency improvements in production processes, and the need for customized solutions are some of the biggest challenges that equipment manufacturers have faced. Over the last decade, infrared fiber lasers became the dominant solutions due to their cost, performance, and size advantages. However, recent application studies have shown that shorter wavelength green and UV DPSS lasers are providing performance and flexibility advantages that provide benefits for system integrators and end-users alike. Advances in compactness, weight, size and performance parameters, as well as demonstrated reliability, ruggedness and durability enabled DPSS lasers to resurface for laser marking applications.

Key Challenges in Laser Marking:

  • Reduced feature sizes in 2D-matrix codes
  • Medical implants requiring marking technology that avoids material debris
  • Mobile device manufacturing requiring colored layer marking for next generation device covers
  • Thin film coatings need for nondestructive marking or high quality, narrow line scribing processes
  • Plastic materials such as wires, tubes, and composite foils requiring shorter wavelengths for smaller feature size and improved contrast

Laser Marking Solutions

Miniaturization, smaller, more compact instruments and tools drive the need for Explorer lasers. The Explorer® laser family is built on proven, dependable, and reliable DPSS architectures, and includes wavelength options at 349, 355, 532, and 1064 nm. Outstanding mode quality with typical M2 values of 1.1 or less and short pulse widths as low as 4 ns bundled with high peak power enable highest quality parts marking. Explorer lasers are equipped with feature rich software capabilities intended to shorten product integration cycles when developing new marking tools or even table top instruments. E-Pulse™ is a very useful feature that provides constant pulse energy over a range of repetition rates and is a great solution when integrating the laser into both gantry and scanner based systems alike.

The Explorer product family includes the It’s in the Box™ Explorer XP 532-5, Explorer XP 355-1, Explorer One™ 355 and 349 nm compact, all-in-one lasers. Competitive products are at least seven times bigger than these pocket-sized Explorer lasers. Explorer lasers have outstanding performance and size advantages where the ultra-compact laser head includes everything for a fast, simple, and cost efficient integration into your marking system or tool.

Laser Subtractive Processes

There are many ultrafast subtractive processes and applications that can be performed, limited only by laser-material interaction. Most ultrafast subtractive processes on hard materials like metals, ceramics and glasses require high pulse energies, so generally femtosecond amplifiers and OPAs are used. Some soft polymers and plant and animal tissues can be modified with lower pulse energies, so femtosecond oscillators and OPOs may be appropriate.

Advantages of femtosecond subtractive micromachining versus longer pulse duration methods include cleaner ablation and minimal heat affected zone. Ultrafast subtractive processes include ablative drilling, cutting and scribing. Surface modification and bulk material modification are other subtractive processes with interesting applications, such as waveguide writing, laser-assisted etching and sensor improvement.

Macro and Micro Material Processing Products