Plasma etching technology has been used in the semiconductor industry since its inception. Etch, due to its very nature is an aggressive and corrosive environment. The MKS Baratron® capacitance manometer was a critical enabling invention for the etch process due to its ability to accurately measure process pressure without significant degradation from the extremely corrosive environment. In the last few years etch processing pressure and stability requirements have increased considerably. The process pressure for critical etch steps has been reduced to very low levels (around 2-3mT) and at the same time there is less tolerance for small pressure instabilities. These instabilities can be caused by process gases impacting the manometer, such as the signal transient seen when manometers are first exposed to fluorine (called the fluorine burn-in effect). Our customers require improved accuracy and stability in the low pressure regime to aid in chamber to chamber and wafer to wafer reproducibility.