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R*evolution® III 6 slm Remote Plasma Source
Overview
The R*evolution® III integrated remote plasma source, with improved capability over the earlier model, provides the highest performing and cleanest source of reactive gas species required in the processing of semiconductor wafers.
Specifications
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TypeAX7695 Integrated Remote Plasma Source
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Ignition Gas Supply100% O2 or Ar, or 90% O2/10% N2 (contact MKS for ignition with other gases)
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Process Gas SupplyUp to 6.0 slm of 100% O2, or 90% O2/10% N2 (contact MKS for ignition with other gases)
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Operating PressureIgnition: 0.5 to 2.0 Torr @ 1.0 to 6.0 slm (pressure measured at R*evolution III outlet)
Process: 0.5 to 2.0 Torr @ 1.0 to 6.0 slm -
OutputReady, AC line, Plasma On, Power Monitor
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InputsPlasma On/Off, Power Set
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Duty Cycle100%
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InterlocksInternal thermal switch and internal water flow switch to protect against insufficient cooling
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Wetted Materials6061-T6 Aluminum, Kalrez®, SiO2, 316L SS, Nickel, Fluorosilicone
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Control InterfaceDiscrete I/O, 9 and 25 pin D connectors, RS-232, DeviceNet™ and Ethernet (MKS TOOLweb®-enabled)
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Power Requirements180 to 228 VAC, 50/60 Hz, 30A, 3 phase
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Cooling Water1.75 gpm, < 30°C
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Operating TemperatureAmbient 40°C max.
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Dimensions15.7 inches long, 13.7 inches wide, 12.14 inches high (399 mm x 348 mm x 308 mm nominal)
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Weight85 lb. (38.6 Kg)
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ComplianceCE, SEMI F47, SEMI S2 (includes S8, S10, S14 assessments), UL 61010-1, CAN/CSA-61010-1
Resources
Literature
- R*evolution III Integrated Remote Plasma Source (archive) (296.2 kB, PDF)
Ultra-High Velocity