O₃MEGA® AX8561 Rack Mounted Integrated Ozone Delivery Subsystem with Electronic Gas & Pressure Control

The O₃MEGA® system redefines ozone delivery subsystems, providing a more compact, complete and integrated solution than ever before. The O₃MEGA® ozone delivery system incorporates MKS’ field proven, high concentration, ultraclean ozone generation technology, an integrated ozone concentration monitor, flow control for both O₂ and dopant gas species, as well as an electronic pressure controller. Designed for maximum configuration flexibility, O₃MEGA® subsystems match ozone value to your process requirements in the smallest, most complete delivery system available.

The O₃MEGA® system retains the compact size of MKS' AX8400 Series ozone generators and includes not only ozone generation but concentration monitoring, flow control and pressure control. The result - it is 60% more compact than competing ozone delivery systems. It is also the first ozone delivery system that can be designed directly into your tool structure or be integrated into a stand-alone MKS AX8555 multi-channel ozone delivery system.

The O₃MEGA® system uses MKS' patented ozone generator cell technology to convert pure oxygen into ozone through silent electrical discharge and achieves the highest ozone concentration levels available. MKS ozone generators are the highest purity ultra high concentration ozone generators on the market. The combination of generator design, high purity wetted materials and extremely minute levels of dopant gas (far below the levels required for competitive ozone generators), result in ultraclean ozone and the lowest levels of contaminants, e.g. NO_x compounds, available at ultra high concentrations.

Ozone is an environmentally friendly alternative to many chemical processes. It has a high redox potential, can be generated at the point-of-use and is easily converted back to oxygen. Typical ozone applications in semiconductor processing include atomic layer deposition (ALD) TEOS/Ozone chemical vapor deposition (CVD), Ta₂O₅CVD, photoresist strip, wafer cleaning, contaminant removal, surface conditioning, and oxide growth.